Blind/buried Via Board

Product name:blindburied via board  CharacteristicLayer count: 8 Board thickness: 1.2mm Base materials: FR4 S1000-2 Finished size:205*174mm Surface finish:ENIG+OSP Line width/line space: 3/3mil Minimum hole: 0.10mm Solder resist color: Sensitive blue Cu thickness: inner layer 1OZ outer layer 1OZSpecifications:1.complicated structure of blind/buried hole, two stage HDI: blind hole: L1-L2,L5-L6 buried hole: L2-L3,L3-L4,L4-L5 through-hole: L1-L8repeatly lamination , chem copperneed laser to drill blind holeline width/line space is small, etching is difficultlamination,circuit,drilling with High accuracy standard